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MR750 SERIES
MR754 and MR760 are Preferred Devices
High Current Lead Mounted Rectifiers
Features
* * * *
Current Capacity Comparable to Chassis Mounted Rectifiers Very High Surge Capacity Insulated Case Pb-Free Packages are Available*
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Mechanical Characteristics:
* Case: Epoxy, Molded * Weight: 2.5 grams (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal Lead * *
is Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Cathode Polarity Band
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50 - 1000 VOLTS DIFFUSED JUNCTION
AXIAL LEAD BUTTON CASE 194 STYLE 1
MARKING DIAGRAM
MR7xx AYYWWG G
MR7 = Device Code xx = 50, 51, 52, 54, 56 or 60 A = Location Code YY = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2007
1
March, 2007 - Rev. 6
Publication Order Number: MR750/D
MR750 SERIES
MAXIMUM RATINGS
Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Non-Repetitive Peak Reverse Voltage (Halfwave, single phase, 60 Hz peak) RMS Reverse Voltage Average Rectified Forward Current (Single phase, resistive load, 60 Hz) (See Figures 5 and 6) Non-Repetitive Peak Surge Current (Surge applied at rated load conditions) Operating and Storage Junction Temperature Range Symbol VRRM VRWM VR VRSM VR(RMS) IO MR750 50 MR751 100 MR752 200 MR754 400 MR756 600 MR760 1000 Unit V
60 35
120 70
240 140
480 280
720 420
1200 700
V V A
22 (TL = 60C, 1/8 in Lead Lengths) 6.0 (TA = 60C, P.C. Board mounting)
IFSM TJ, Tstg
400 (for 1 cycle) *65 to +175
A C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ELECTRICAL CHARACTERISTICS
Characteristic and Conditions Maximum Instantaneous Forward Voltage Drop (iF = 100 A, TJ = 25C) Maximum Forward Voltage Drop (IF = 6.0 A, TA = 25C, 3/8 in leads) Maximum Reverse Current (Rated DC Voltage) TJ = 25C TJ = 100C Symbol vF VF IR Max 1.25 0.90 25 1.0 Unit V V mA mA
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MR750 SERIES
IFSM , PEAK HALF WAVE CURRENT (AMP) 700 500 300 200 TYPICAL iF, INSTANTANEOUS FORWARD CURRENT (AMP) 100 70 50 30 20 TJ = 25C 600 400 300 25C 200 25C TJ = 175C 100 80 60 1.0 2.0 5.0 10 20 50 100 NUMBER OF CYCLES AT 60 Hz 175C VRRM MAY BE APPLIED BETWEEN EACH CYCLE OF SURGE. THE TJ NOTED IS TJ PRIOR TO SURGE
MAXIMUM
10 7.0 5.0 3.0 2.0 COEFFICIENT (mV/ C) +0.5
Figure 2. Maximum Surge Capability
0 TYPICAL RANGE
-0.5
1.0 0.7 0.5 0.3 0.2 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
-1.0
-1.5 -2.0 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 iF, INSTANTANEOUS FORWARD CURRENT (AMP)
Figure 1. Forward Voltage
20 10 5.0
HEAT SINK
Figure 3. Forward Voltage Temperature Coefficient
R JL(t) , JUNCTION-TO-LEAD TRANSIENT THERMAL RESISTANCE ( C/W)
L
L
1/2" 3/8" 1/4" 1/8"
Both leads to heat sink, with lengths as shown. Variations in RqJL(t) below 2.0 seconds are independent of lead connections of 1/8 inch or greater, and vary only about 20% from the values shown. Values for times greater than 2.0 seconds may be obtained by drawing a curve, with the end point (at 70 seconds) taken from Figure 8, or calculated from the notes, using the given curves as a guide. Either typical or maximum values may be used. For RqJL(t) values at pulse widths less than 0.1 second, the above curve can be extrapolated down to 10 ms at a continuing slope.
3.0 2.0 1.0 0.5 0.3 0.2 0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0
10
20
30
50
70
t, TIME (SECONDS)
Figure 4. Typical Transient Thermal Resistance
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MR750 SERIES
IF(AV), AVERAGE FORWARD CURRENT (AMPS) 28 L = 1/8" 24 20 16 12 8.0 4.0 0 0 20 40 60 80 100 120 140 160 180 200 1/4" 3/8" RESISTIVE INDUCTIVE LOADS BOTH LEADS TO HEAT SINK WITH LENGTHS AS SHOWN 5/8" IF(AV), AVERAGE FORWARD CURRENT (AMPS) 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0 20 40 RqJA = 40C/W SEE NOTE 6F (IPK/IAVE = 6.28) 60 80 100 120 140 160 180 200 RqJA = 25C/W SEE NOTE RESISTIVE INDUCTIVE LOADS CAPACITANCE LOADS - 1F & 3F I(pk) = 5 Iavg I(pk) = 10 Iavg I(pk) = 20 Iavg f = 60 Hz
TL, LEAD TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 5. Maximum Current Ratings
Figure 6. Maximum Current Ratings
NOTES
32 PF(AV), POWER DISSIPATION (WATTS) 28 24 20 16 12 8.0 4.0 0 0 4.0 8.0 12 16 20 24 28 32 RESISTIVE - INDUCTIVE LOADS Use of the above model permits junction to lead thermal resistance for any mounting configuration to be found. Lowest values occur when one side of the rectifier is brought as close as possible to the heat sink as shown below. Terms in the model signify: TA = Ambient Temperature TC = Case Temperature TL = Lead Temperature TJ = Junction Temperature RqS = Thermal Resistance, Heat Sink to Ambient RqL = Thermal Resistance, Lead to Heat Sink RqJ = Thermal Resistance, Junction to Case PF = Power Dissipation (Subscripts A and K refer to anode and cathode sides, respectively.) Values for thermal resistance components are: RqL = 40C/W/in. Typically and 44C/W/in Maximum. RqJ = 2C/W typically and 4C/W Maximum. Since RqJ is so low, measurements of the case temperature, TC, will be approximately equal to junction temperature in practical lead mounted applications. When used as a 60 Hz rectifierm the slow thermal response holds TJ(PK) close to TJ(AVG). Therefore maximum lead temperature may be found from: TL = 175-RqJL PF. PF may be found from Figure 7. The recommended method of mounting to a P.C. board is shown on the sketch, where RqJA is approximately 25C/W for a 1-1/2" x 1-1/2" copper surface area. Values of 40C/W are typical for mounting to terminal strips or P.C. boards where available surface area is small. CAPACITANCE LOADS I(pk) = 5 Iavg 10 Iavg 20 Iavg 6F 1F & 3F
RqS(A) TA(A) TL(A) TC(A) TJ
THERMAL CIRCUIT MODEL
(For Heat Conduction Through The Leads)
RqL(A) RqJ(A) RqJ(K) PF TC(K) TL(K) RqL(K) RqS(K) TA(K)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 7. Power Dissipation
40 R JL , THERMAL RESISTANCE, JUNCTION-TO-LEAD( C/W) 35 30 25 20 15 10 5.0 0 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0 L, LEAD LENGTH (INCHES) BOTH LEADS TO HEAT SINK, EQUAL LENGTH SINGLE LEAD TO HEAT SINK, INSIGNIFICANT HEAT FLOW THROUGH OTHER LEAD
Figure 8. Steady State Thermal Resistance
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EE EE EE EE EE EE EE EE
Board Ground Plane Recommended mounting for half wave circuit
MR750 SERIES
100 70 TJ = 175C CURRENT INPUT WAVEFORM 30 TJ = 25C t rr , REVERSE RECOVERY TIME (m s) RELATIVE EFFICIENCY (%) 30 20 TJ = 25C 10 7.0 5.0 3.0 2.0 1.0 0.1 0 IR trr 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 IF = 5 A 3A 1A IF
50
20 1.0
2.0 3.0
5.0 7.0 10
20
30
50
70 100
REPETITION FREQUENCY (kHz)
IR/IF, RATIO OF REVERSE TO FORWARD CURRENT
Figure 9. Rectification Efficiency
1000 700 500 C, CAPACITANCE (pF) 300 200 100 70 50 30 20 10 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 VR, REVERSE VOLTAGE (VOLTS) 1.0 t fr , FORWARD RECOVERY TIME (m s) TJ = 25C 0.7
Figure 10. Reverse Recovery Time
uf tfr ufr
TJ = 25C
0.5 ufr = 1.0 V 0.3 0.2 ufr = 2.0 V 0.1 1.0 2.0 3.0 5.0 7.0 10 IF, FORWARD PULSE CURRENT (AMP)
Figure 11. Junction Capacitance
Figure 12. Forward Recovery Time
RS RL VO
For a square wave input of amplitude Vm, the efficiency factor becomes:
V2m 2R L (square) + V2m .100% + 50% RL
(3)
Figure 13. Single-Phase Half-Wave Rectifier Circuit
The rectification efficiency factor shown in Figure 9 was calculated using the formula:
(1) V 2o (dc) .100%+ .100% + + V2o(rms) P (rms) V 2o (ac) ) V 2o (dc) RL P (dc) V2o (dc) RL
For a sine wave input Vm sin (wt) to the diode, assumed lossless, the maximum theoretical efficiency factor becomes:
V2m p2RL (sine) + V2m .100% + 4 .100% + 40.6% 2 4R L
(A full wave circuit has twice these efficiencies) As the frequency of the input signal is increased, the reverse recovery time of the diode (Figure 10) becomes significant, resulting in an increasing AC voltage component across RL which is opposite in polarity to the forward current, thereby reducing the value of the efficiency factor , as shown on Figure 9. It should be emphasized that Figure 9 shows waveform efficiency only; it does not provide a measure of diode losses. Data was obtained by measuring the AC component of Vo with a true rms AC voltmeter and the DC component with a DC voltmeter. The data was used in Equation 1 to obtain points for Figure 9.
(2)
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MR750 SERIES
ORDERING INFORMATION
Device MR750 MR750G MR750RL MR750RLG MR751 MR751G MR751RL MR751RLG MR752 MR752G MR752RL MR752RLG MR754 MR754G MR754RL MR754RLG MR756 MR756G MR756RL MR756RLG MR760 MR760G MR760RL MR760RLG Package Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) Axial Lead Axial Lead (Pb-Free) 800 / Tape & Reel 1000 Units / Box 800 / Tape & Reel 1000 Units / Box 800 / Tape & Reel 1000 Units / Box 800 / Tape & Reel 1000 Units / Box 800 / Tape & Reel 1000 Units / Box 800 / Tape & Reel 1000 Units / Box Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MR750 SERIES
PACKAGE DIMENSIONS
AXIAL LEAD BUTTON CASE 194-04 ISSUE H
A D
1
NOTES: 1. CATHODE SYMBOL ON PACKAGE. 2. 194-01 OBSOLETE, 194-04 NEW STANDARD. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 8.43 8.69 0.332 0.342 B 5.94 6.25 0.234 0.246 D 1.27 1.35 0.050 0.053 K 25.15 25.65 0.990 1.010 STYLE 1: PIN 1. CATHODE 2. ANODE
K
B K
2
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MR750/D

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